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| Wafers |
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SILTRONIX grows CZ (Czochralsky) silicon crystals and sources FZ (Float Zone) crystals to machine or polish wafers according to your specifications.
We supply small and large batches of standard or customised products.
Our customers are :
- Industrial manufacturers in various lines of business
- Research & Development Laboratories and Institutes
- Universities
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| Services |
The best solution for each of your needs
| We can provide services on demand, ... |
- Crystal pulling process (ex: material tests or doping poly-Si for solar industry...)
- Precision machining
- Crystal orientation: (100) (111) (110) (211) (512) (311)... up to +/- 0.01°
- Crystal off orientation up to 25°
- Laser cutting (ex: wafer transformation: 8" ␣ 6"...)
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- Edge rounding services
- Wire saw slicing from 200 μm to 1700 μm
- Acid or KOH chemical etching
- Lapping, thinning, polishing, reclaim (flatness 0.5 μm / roughness 1.5 Å)
- Sorting by resistivity, orientation, bow, TTV..
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... additional steps...
- Thermal oxidation, thin layer deposition: SiO2, Si3N4, SiC...
- Laser marking, printing
- Dicing: all sizes - maximum thickness 1.5 mm
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... and processing of different materials
- Monocrystalline or polycrystalline silicon
- Others semiconductor materials like : germanium, sapphire...
- Ceramics: alumina (Al2O3), quartz, glass.
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